Huawei working on next ‘Kirin 990’ chipset

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Huawei, a Chinese Tech Giant is working on its upcoming  “Kirin 990” chipset with the Taiwan Semiconductor Manufacturing Company (TSMC) that is likely to be unveiled in the first span of 2019.

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The processor would also feature the second generation 7 nm process and is also likely to debut as the first 5G ready chip from the company.

Industry chain sources claim that the Huawei has already started working on the Kirin 990 SoC. The cost of testing the Kirin 990 chipset is very expensive. Each test requires an investment of around 200 million Yuan,” Gizmo China reported on Friday.

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The processor is expected to arrive with “Balong 5000 5G” modem.

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The more advanced fabrication technology that will be used to manufacture the Kirin 990 offers 20 per cent increased transistor density, 10 per cent reduced power consumption, and 10 per cent improved overall performance compared to the chipsets built using the first-generation 7nm chipset from TSMC,” The Android Headlines said.

The tech giant has launched iys Kirin 980 chip at IFA in Berlin in the month of August that power its flagship devices.

The chipset is scheduled to debut in the Indian market in the fourth quarter of this year.

Huawei Consumer Business Group CEO Richard Yu had confirmed that the first smartphone to be powered by the Kirin 980 chipset will be from Mate 20 series which is to be launched in London on October 16.

Kirin 980 is said to be the world’s first SoC to sport the modem which supports the LTE Category 21 that also supports the downlink of 1.4Gbps said Huawei.

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